리얼지니어스

AMD Shares New Second-Gen 3D V-Cache Chiplet Details, up to 2.5TB/s, tom's Hardware, Link 저 V-cache가 업그레이드가 된 것. Row 0 - Cell 0 2nd-Gen 7nm 3D V-Cache Die First-Gen 7nm 3D V-Cache Die 5nm Zen 4 Core Complex Die (CCD) 7nm Zen 3 Core Complex Die (CCD) Size 36mm^2 41mm^2 66.3 mm^2 80.7mm^2 Transistor Count ~4.7 Billion 4.7 Billion 6.57 Billion 4.15 Billion MTr/mm^2 (Transistor Density) ~130.6 Milli..

기사 LINK A leitmotiv of the conference "Moore's Law is dead. All we have left is packaging." Chiplet based designs mens 2.5D designs, not 3D. TSMC announced 3Dblox at OIP, which is an open standard which quoting from that post. 3Dblox provides generic language constructs capable of representing all current and future 3D-IC structures. Modularize the 3D-IC structures such that EDA tools and design..