Study/Computer System 3

[Review][Article] Chiplet Summit: Challenges of Chiplet-Based Designs

기사 LINK A leitmotiv of the conference "Moore's Law is dead. All we have left is packaging." Chiplet based designs mens 2.5D designs, not 3D. TSMC announced 3Dblox at OIP, which is an open standard which quoting from that post. 3Dblox provides generic language constructs capable of representing all current and future 3D-IC structures. Modularize the 3D-IC structures such that EDA tools and design..