[Review][Article] Chiplet Summit: Challenges of Chiplet-Based Designs

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A leitmotiv of the conference
"Moore's Law is dead. All we have left is packaging."

 

1. Chiplet based designs mens 2.5D designs, not 3D.
2. TSMC announced 3Dblox at OIP, which is an open standard which quoting from that post.
   • 3Dblox provides generic language constructs capable of representing all current and future 3D-IC structures.
   • Modularize the 3D-IC structures such that EDA tools and design flow can be simpler and efficient
   • Ensure standardized EDA tools and design flows are compliant to TSMC 3DFabric technology
3. CDCXML, which stands for Chip Data Exchange Markup Language, was developed by OCP.
4. Two viable standards for communication, BoW and UCIe.
5. Known Good Die, KGD, has become much more important with chiplet, multiple die in a package.