Study/VLSI

[Die-to-Die system] Materials, Article - For the First Time, UCIe Shares Bandwidth Speeds Between Chiplets

와와치 2023. 6. 9. 23:21

자료를 구할 수 없어서 아쉬워 하는 중.

ISC2023 발표자료인데, 어디서 구할 수 있을 수도 있지 않을까.

https://www.hpcwire.com/2023/06/07/for-the-first-time-ucie-shares-bandwidth-speeds-between-chiplets/

 

For the First Time, UCIe Shares Bandwidth Speeds Between Chiplets

The first numbers of the available bandwidth between chiplets is out – UCIe is estimating that chiplet packages could squeeze out communication speeds of 630Gbps, or 0.63Tbps, in a very tight area. That number was shared by the Universal Chiplet Intercon

www.hpcwire.com

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https://app.swapcard.com/widget/event/isc-high-performance-2023/planning/UGxhbm5pbmdfMTIyMDk5OA==

 

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